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Techneeds
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Die Attach Assemblers
Lawrence, MA 01840 US
2023-04-14
2023-07-09
Employment Type:
Contract
Industry: Light Industrial/Manufacturing
Job Number: 58957
Office Location: Salem
Job Description
Our client is one of the fastest growing companies to provide electronic semiconductor components to a variety of industries and is one of the largest U.S. based providers of Semiconductors. They are expanding their production capacity opening a new 2nd shift operation. Join a team that is consistently growing and looking to fill several openings in their assembly and test departments.
The 1st Shift Hours Are Monday-Friday 7am to 3:30pm and the Split Shift Would Be Monday-Friday 12pm to 8:30pm.
Die bonding is a manufacturing process used in the packaging of semiconductors. It is the act of attaching a die (or chip) to a substrate or package by epoxy or solder, also known as die placement or die attach. The process starts with picking a die from a wafer or waffle pack and then placing it at a specific location on the substrate. The die is placed into a previously dispensed epoxy or placed into solder (eutectic).
In the case of eutectic die bonding, the process involves heat and gas management to control the conditions of reflow of the solder.
The 1st Shift Hours Are Monday-Friday 7am to 3:30pm and the Split Shift Would Be Monday-Friday 12pm to 8:30pm.
Die bonding is a manufacturing process used in the packaging of semiconductors. It is the act of attaching a die (or chip) to a substrate or package by epoxy or solder, also known as die placement or die attach. The process starts with picking a die from a wafer or waffle pack and then placing it at a specific location on the substrate. The die is placed into a previously dispensed epoxy or placed into solder (eutectic).
In the case of eutectic die bonding, the process involves heat and gas management to control the conditions of reflow of the solder.
- Assemble diode and transistor products including:
- Operate Equipment
- Die Pick and Place
- Auto Bonding
- Seam Sealing
- Environmental Testing
- High School Diploma or equivalent and minimum 3 years exp.
- Read/Write English
- Basic Computer Skills (Data Entry)
- Familiarity with ESD/Clean Room Protocol
- Detail Oriented
- Familiarity with ISO9001 and MIL-PRF-19500
- Ability to manipulate small parts with tweezers and other hand tools
- Ability to work with a microscope for extended periods
- Able to lift 20 lbs., sit, stand, and walk for extended periods
Job Requirements
Die Attach, Hybrid Epoxy, Hand Solder, Seam Seal And Capping